Wafer Point Analytics
Capacity and Qualification TrackerNo. 3 · Q3 2026
Capacity and Qualification Tracker · Advanced packagingData to 30 September 2026
Interposer lines qualify on time as hybrid bonding slips
Four interposer lines passed customer qualification in the third quarter. Two hybrid bonding sites pushed their volume dates into 2027
1Where capacity stands
Sites we track have announced 247 thousand wafer equivalents a month of advanced packaging capacity due by the end of 2027. By 30 September, 109 thousand had passed customer qualification, up 16 thousand in the quarter, and almost all of the gain came on interposer lines.1
| Technology | Announced | Qualified | Share | Added in Q3 |
|---|---|---|---|---|
| Interposer | 145 | 92 | 63% | +14 |
| Panel level | 38 | 6 | 16% | +2 |
| Hybrid bonding | 52 | 11 | 21% | 0 |
| Glass core substrate | 12 | 0 | 0% | 0 |
| All tracked | 247 | 109 | 44% | +16 |
Source: company filings and earnings calls, government incentive award notices, equipment import records, supplier announcements, Wafer Point Analytics estimates
Source: company filings and earnings calls, government incentive award notices, equipment import records, supplier announcements, Wafer Point Analytics estimates
2Qualified this quarter
Four interposer lines and one panel line passed qualification in the quarter. Three of the five qualified in or before the promised quarter. The second Taiwan foundry line and the Korean panel line each arrived one quarter late.
| Site | Technology | Capacity | Promised | Qualified |
|---|---|---|---|---|
| Taiwan foundry, site A | Interposer | 5.0 | Q3 2026 | Jul 2026 |
| Taiwan foundry, site B | Interposer | 4.0 | Q2 2026 | Sep 2026 |
| US assembly house | Interposer | 3.0 | Q4 2026 | Sep 2026 |
| Malaysian assembly house | Interposer | 2.0 | Q3 2026 | Aug 2026 |
| Korean memory maker | Panel level | 2.0 | Q2 2026 | Aug 2026 |
| Total | 16.0 |
Source: company filings and earnings calls, government incentive award notices, equipment import records, supplier announcements, Wafer Point Analytics estimates
3Dates that moved
Four sites revised their volume dates in the quarter, all of them later. Hybrid bonding dates have now slipped an average of 7.8 months from first announcement, against 2.1 months for interposer lines.2
| Site | Technology | Previous | Current | Moved |
|---|---|---|---|---|
| Korean memory maker | Hybrid bonding | Q4 2026 | Q2 2027 | 2 quarters |
| US logic maker | Hybrid bonding | Q3 2026 | Q2 2027 | 3 quarters |
| Japanese substrate maker | Glass core | Q4 2027 | Q2 2028 | 2 quarters |
| Taiwan assembly house | Panel level | Q4 2026 | Q1 2027 | 1 quarter |
Source: company filings, earnings call transcripts and supplier announcements, July to September 2026
Source: company filings and earnings calls, government incentive award notices, equipment import records, supplier announcements, Wafer Point Analytics estimates
4Against our Back End Facility Census
5What to watch in the fourth quarter
Four interposer lines promised for the fourth quarter, equipment move in at the first glass core pilot line, and whether the revised hybrid bonding dates hold through year end customer audits.
How this tracker is built
- Capacity is announced monthly output at full ramp, converted to 300 mm wafer equivalents with the conversion table held on file
- Qualified means a customer has approved the line for volume production, confirmed in a filing, call transcript or supplier release
- Every date revision is kept with its source, so each site's history reads back to its first announcement
Approved for subscribersDaniel OkaforDirector of Packaging Research · 8 October 2026
1 Panel capacity is converted at 3.2 wafer equivalents per 510 by 515 mm panel. Sites in mainland China are tracked separately and excluded here.
2 Slip runs from the first dated public announcement to the current promised quarter, averaged across all tracked sites, with sites that have held their date counted at zero.